HDI PCB (High‑Density Interconnect PCB) adopts micro‑vias, fine traces and small pad technology to realize high‑density component layout. Shorter signal paths reduce signal loss and crosstalk. HDI boards are critical for smartphones, IoT hardware and miniaturized high‑speed products, supporting multi‑layer stack‑up and precise impedance‑control requirements.
Aluminum base PCB is a metal‑core circuit board designed for excellent heat dissipation. The aluminum substrate quickly transfers heat generated by power components outward to avoid overheating risks. It is mainly used for LED lighting, motor drivers.
High‑frequency RF PCB is manufactured with low‑Dk and low‑Df special substrates such as PTFE. It maintains stable dielectric performance under high‑frequency signal transmission and minimizes signal attenuation. This type of PCB is widely used for communication base stations, radar modules and RF sensor hardware with strict signal‑integrity requirements.
